HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 884

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

FKEY—Flash Key Code Register
FMATS—Flash Mat Select Register
Initial value
Initial value
Read/Write
Initial value
Read/Write
Bit
Bit
MS7
R/W
7
0
1
Mat select
H'AA
H'00
R/W
K7
7
0
Key code
H'A5
H'5A
H'00
User boot mode is selected (user mat selection when FMATS is not H'AA).
Initial value when started up in user boot mode.
Initial value when not started up in user boot mode (user mat selection)
[Programmable condition] Program being executed is in on-chip RAM
MS6
R/W
6
0
0
Write to SC0 bit is enabled (SC0 bit can be set only when FKEY is H'A5)
Programming/erase is enabled (software-protection state when FKEY is not H'5A)
Initial value
R/W
K6
6
0
MS5
R/W
5
0
1
R/W
K5
5
0
MS4
R/W
4
0
0
R/W
MS3
R/W
K4
4
0
3
0
1
MS2
R/W
R/W
2
0
0
K3
3
0
H'EE0B4
H'EE0B5
MS1
R/W
Rev. 2.0, 06/04, page 855 of 980
1
0
1
R/W
K2
2
0
MS0
R/W
0
0
0
(Mode other than user boot mode)
(User boot mode)
Flash Memory
Flash Memory
R/W
K1
1
0
R/W
K0
0
0