HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 268

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 7.15 shows an auto-requested burst-mode transfer. This example shows a transfer of three
words from a 16-bit two-state access area to another 16-bit two-state access area.
When the DMAC is activated from a DREQ pin there is a minimum interval of four states from
when the transfer is requested until the DMAC starts operating. The DREQ pin is not sampled
during the time between the transfer request and the start of the transfer. In short address mode
and normal mode, the pin is next sampled at the end of the read cycle. In block transfer mode, the
pin is next sampled at the end of one block transfer.
Address
bus
RD
HWR
LWR
,
CPU cycle
T
1
T
2
T
d
T
1
Source
address
Figure 7.15 Burst DMA Bus Timing
T
2
T
Destination
address
1
T
2
T
DMAC cycle
1
T
2
T
1
T
2
Rev. 2.0, 06/04, page 239 of 980
T
1
T
2
T
1
T
2
T
CPU cycle
1
T
2