HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 223

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

In the event of contention with a bus request from an external bus master when a transition is
made to software standby mode, the BACK and strobe states may be indeterminate after the
transition to software standby mode (see figure 6.36).
When software standby mode is used, the BRLE bit should be cleared to 0 in BRCR before
executing the SLEEP instruction.
Rev. 2.0, 06/04, page 194 of 980
Address bus
Data bus
,
Figure 6.48 Example of External Bus Master Operation
T
High
0
(1)
CPU cycles
Minimum 3 cycles
T
Address
1
T
2
(2)
(3)
External bus released
High-impedance
High-impedance
High-impedance
High-impedance
High-impedance
(4)
(5)
(6)
CPU cycles