HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 114

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5.1
5.1.1
The interrupt controller has the following features:
Note: * NMI input is sometimes disabled when flash memory is being programmed or erased. For
Interrupt priority registers (IPRs) for setting interrupt priorities
Interrupts other than NMI can be assigned to two priority levels on a module-by-module basis
in interrupt priority registers A and B (IPRA and IPRB).
Three-level masking by the I and UI bits in the CPU condition code register (CCR)
Seven external interrupt pins
NMI has the highest priority and is always accepted*; either the rising or falling edge can be
selected. For each of IRQ
independently.
details see section 18.4.5 Flash Vector Address Control Register (FVACR).
Overview
Features
Section 5 Interrupt Controller
0
to IRQ
5
, sensing of the falling edge or level sensing can be selected
Rev. 2.0, 06/04, page 85 of 980