HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 267

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Figure 7.14 shows the timing when the DMAC is activated by low input at a DREQ pin. This
example shows a word-size transfer from a 16-bit two-state access area to another 16-bit two-state
access area. The DMAC continues the transfer while the DREQ pin is held low.
Rev. 2.0, 06/04, page 238 of 980
DREQ
Address
bus
RD
HWR
TEND
,
LWR
Figure 7.14 Bus Timing of DMA Transfer Requested by Low DREQ
T
1
CPU cycle
T
2
T
3
T
d
T
1
DMAC cycle
Source
address
T
2
T
Destination
address
1
T
2
T
CPU cycle
1
T
2
T
d
DMAC cycle
(last transfer cycle)
T
1
Source
address
T
2
DREQ Input
DREQ
DREQ
T
Destination
address
1
T
2
T
CPU cycle
1
T
2