HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 757

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
21.2
21.2.1
Table 21.11 lists the absolute maximum ratings.
Table 21.11 Absolute Maximum Ratings
Item
Power supply voltage
Input voltage (FWE)*
Input voltage (except for port 7)*
Input voltage (port 7)
Reference voltage
Analog power supply voltage
Analog input voltage
Operating temperature
Storage temperature
Caution: Permanent damage to the chip may result if absolute maximum ratings are exceeded.
Notes: *1 Do not apply the power supply voltage to the V
Rev. 2.0, 06/04, page 728 of 980
*2 12 V must not be applied to any pin, as this may cause permanent damage to the
*3 The operating temperature range for flash memory programming/erasing is T
Electrical Characteristics of HD64F3029F25W and
HD64F3029TE25W
Absolute Maximum Ratings
between this pin and GND.
device.
+85°C (Wide-range specifications).
2
2
Symbol
V
V
AV
V
V
V
V
T
T
opr
stg
CC
in
in
in
REF
AN
CC
*
1
Value
–0.3 to +4.6
–0.3 to V
–0.3 to V
–0.3 to AV
–0.3 to AV
–0.3 to +4.6
–0.3 to AV
Wide-range specifications: –40 to +85*
–55 to +125
CL
CC
CC
CC
CC
CC
pin. Connect an external capacitor
+0.3
+0.3
+0.3
+0.3
+0.3
a
3
= 0 to
Unit
V
V
V
V
V
V
V
°C
°C

Related parts for HD64F3029XBL25V