HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 110

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
4.5
Figure 4.5 shows the stack after completion of trap instruction exception handling and interrupt
exception handling.
SP
SP
SP
SP
SP (ER7)
SP
SP
SP
SP
SP (ER7)
Legend
PCE:
PCH:
PCL:
CCR:
SP:
Notes:
4
3
2
1
4
3
2
1
Bits 23 to 16 of program counter (PC)
Bits 15 to 8 of program counter (PC)
Bits 7 to 0 of program counter (PC)
Condition code register
Stack pointer
*1
*2
Stack Status after Exception Handling
Cannot be selected in H8/3029
Ignored at return.
1.
2.
PC indicates the address of the first instruction that will be executed after return.
Registers must be saved in word or longword size at even addresses.
Before exception handling
Before exception handling
Figure 4.5 Stack after Completion of Exception Handling
Stack area
Stack area
b. Advanced mode
a. Normal mode*
Pushed on stack
Pushed on stack
SP (ER7)
SP+1
SP+2
SP+3
SP+4
SP (ER7)
SP+1
SP+2
SP+3
SP+4
1
After exception handling
After exception handling
Rev. 2.0, 06/04, page 81 of 980
CCR
CCR
CCR
PC
PC
PC
PC
PC
H
L
E
H
L
*
2
Even address
Even address

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