HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 544

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
1. End of serial data transmission
2. TE bit = 0
3. CKE1 bit = 1
4. C/A bit = 0 ... switchover to port output
5. CKE1 bit = 0
SCK/port
Data
TE
C/A
CKE1
CKE0
Figure 13.24 Operation when Switching from SCK Pin Function to Port Pin Function
Sample Procedure for Avoiding Low-Level Output: As this sample procedure temporarily
places the SCK pin in the input state, the SCK/port pin should be pulled up beforehand with an
external circuit.
With DDR = 1, DR = 1, C/A = 1, CKE1 = 0, CKE0 = 0, and TE = 1, make the following
settings in the order shown.
Bit 6
Bit 7
(Example of Preventing Low-Level Output)
1. End of transmission
2.
TE= 0
3. CKE1= 1
Rev. 2.0, 06/04, page 515 of 980
4.
C/A= 0
High-level output TE
5. CKE1= 0

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