HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 610

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.1 Location of FWE and MD Pins and Operating Modes
Pin
RES
FWE
MD0
MD1
MD2
NMI
Note:
18.2.3
The comparison table of programming and erasing related items about boot mode, user program
mode, user boot mode, and PROM mode is shown in table 18.2.
* Modes 1 to 4 are on-chip ROM invalid modes.
Mode Comparison
Modes 5 and 7 are on-chip ROM valid modes. For details, see section 3, MCU
Operating Modes.
Reset
state
0/1
0/1
0/1
0/1
0/1
0
On-chip
ROM
invalid
mode*
0/1
0/1
0
0/1
1
0
0
0
1
On-chip
ROM
valid
mode*
0/1
0/1
1
0
1
1
Mode
User
program
mode
0/1
0/1
1
1
1
1
User
boot
mode
Rev. 2.0, 06/04, page 581 of 980
0/1
1
1
1
0
0
Boot
mode
0/1
1
1
1
0
1
PROM
mode
0/1
1
1
0
0
0