HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 279

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

7.6
7.6.1
Word data cannot be accessed starting at an odd address. When word-size transfer is selected, set
even values in the memory and I/O address registers (MAR and IOAR).
7.6.2
The DMAC itself cannot be accessed during a DMAC cycle. DMAC registers cannot be specified
as source or destination addresses.
7.6.3
A memory address register can be accessed as longword data at the MARR address.
Example
Four byte accesses are performed. Note that the CPU may release the bus between the second byte
(MARE) and third byte (MARH).
Memory address registers should be written and read only when the DMAC is halted.
7.6.4
Full address mode is controlled by two registers: DTCRA and DTCRB. Care must be taken to
prevent the B channel from operating in short address mode during the register setup. The enable
bits (DTE and DTME) should not be set to 1 until the end of the setup procedure.
Rev. 2.0, 06/04, page 250 of 980
MOV.L #LBL, ER0
MOV.L ER0, @MARR
Usage Notes
Note on Word Data Transfer
DMAC Self-Access
Longword Access to Memory Address Registers
Note on Full Address Mode Setup