HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 709

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 18.28 (1) Useable Area for Programming in User Program Mode
Programming
Procedure
Operation for Settings of Initial
Parameter
Execution of Initialization
Judgement of Initialization
Result
Operation for Initialization Error
Rev. 2.0, 06/04, page 680 of 980
Item
Storage Area for
Program Data
Operation for
Selection of On-
chip Program to
be Downloaded
Operation for
Writing H'A5 to
Key Register
Execution of
Writing SC0 = 1
to FCCS
(Download)
Operation for
Key Register
Clear
Judgement of
Download Result
Operation for
Download Error
Storable /Executable Area
On-chip
RAM
User
MAT
*
External Space
(Expanded Mode)
Selected MAT
User
MAT
—
Embedded
Program Storage
Area
—