HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 116

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

5.1.3
Table 5.1 lists the interrupt pins.
Table 5.1
Name
Nonmaskable interrupt
External interrupt request 5 to 0
Note:
5.1.4
Table 5.2 lists the registers of the interrupt controller.
Table 5.2
Address*
H'EE012
H'EE014
H'EE015
H'EE016
H'EE018
H'EE019
Notes: *1 Lower 20 bits of the address in advanced mode.
* NMI input is sometimes disabled when flash memory is being programmed or erased.
*2 Only 0 can be written, to clear flags.
Pin Configuration
Register Configuration
1
For details see section 18.4.5, Flash Vector Address Control Register (FVACR).
Interrupt Pins
Interrupt Controller Registers
Name
System control register
IRQ sense control register
IRQ enable register
IRQ status register
Interrupt priority register A
Interrupt priority register B
Abbreviation I/O
NMI
IRQ
5
to IRQ
0
Input Nonmaskable interrupt*, rising edge or
Input Maskable interrupts, falling edge or level
Abbreviation
SYSCR
ISCR
IER
ISR
IPRA
IPRB
Function
falling edge selectable
sensing selectable
R/W
R/(W)*
R/W
R/W
R/W
R/W
R/W
Rev. 2.0, 06/04, page 87 of 980
2
H'09
Initial Value
H'00
H'00
H'00
H'00
H'00