HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 169

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 6.3
ABWCR ASTCR WCRH/WCRL
ABWn
0
1
Note: n = 7 to 0
6.3.3
The H8/3029 memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface that allows direct connection of DRAM; and a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface is designated functions as DRAM space, and area 0 for which the
burst ROM interface is designated functions as burst ROM space.
Rev. 2.0, 06/04, page 140 of 980
ASTn
0
1
0
1
Memory Interfaces
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Access States
2
3
2
3
Program Wait States
0
0
1
2
3
0
0
1
2
3