HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 599

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

16.3
The D/A converter has two built-in D/A conversion circuits that can perform conversion
independently.
D/A conversion is performed constantly while enabled in DACR. If the DADR0 or DADR1 value
is modified, conversion of the new data begins immediately. The conversion results are output
when bits DAOE0 and DAOE1 are set to 1.
An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 16.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA0 becomes an output pin. The
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
Rev. 2.0, 06/04, page 570 of 980
converted result is output after the conversion time.
Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
the conversion time.
The output value is
Operation
DADR contents
256
V
REF