HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 208

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

When software standby mode is used, the BRLE bit should be cleared to 0 in BRCR before
executing the SLEEP instruction.
Similar contention in a transition to self-refresh mode may prevent dependable strobe
waveform output. This can also be avoided by clearing the BRLE bit to 0 in BRCR.
Immediately after self-refreshing is cleared, external bus release is possible during a given
period until the start of a CPU cycle. Attention must be paid to the RAS state to ensure that
the specification for the RAS precharge time immediately after self-refreshing is met.
External bus released
Refresh cycle
CPU cycle
Refresh cycle
Refresh
request
Figure 6.35 Bus-Released State and Refresh Cycles
Software standby mode
Address bus
Strobe
Figure 6.36 Bus-Released State and Software Standby Mode
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