HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 938

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

SCMR—Smart Card Mode Register
Initial value
Read/Write
Bit
7
1
6
1
5
1
4
1
Smart card data transfer direction
0
1
SDIR
R/W
3
0
TDR contents are transmitted LSB-first
TDR contents are transmitted MSB-first
Receive data is stored LSB-first in RDR
Receive data is stored MSB-first in RDR
Smart card data invert
0
1
SINV
R/W
2
0
Unmodified TDR contents are transmitted
Receive data is stored unmodified in RDR
Inverted 1/0 logic levels of TDR contents are transmitted
1/0 logic levels of received data are inverted before storage in RDR
Smart card interface mode select
0
1
1
1
Smart card interface function is disabled
Smart card interface function is enabled
SMIF
R/W
0
0
H'FFFB6
Rev. 2.0, 06/04, page 909 of 980
(Initial value)
SCI0
(Initial value)
(Initial value)