HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 220

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
6.9.2
Table 6.11 shows the pin states in an idle cycle.
Table 6.11 Pin States in Idle Cycle
Pins
A
D
CSn
UCAS, LCAS
AS
RD
HWR
LWR
Note:
23
15
Address bus
to A
to D
0
0
* Remains low in DRAM space RAS down mode.
CSn
Pin States in Idle Cycle
RD
Simultaneous change of
Possibility of mutual overlap
(a) Idle cycle not inserted
T1
Bus cycle A
T2
Figure 6.47 Example of Idle Cycle Operation (5)
T3
Bus cycle B
T1
RD
and
T2
CSn
Pin State
Next cycle address value
High impedance
High*
High
High
High
High
High
Address bus
CSn
RD
Rev. 2.0, 06/04, page 191 of 980
T1
Bus cycle A
(b) Idle cycle inserted
T2
T3
Bus cycle B
Ti
T1
T2

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