HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 701

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.10.2 AC Characteristics and Timing in Writer Mode
Table 18.20 AC Characteristics in Memory Read Mode
Condition : V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
WE rise time
WE fall time
Rev. 2.0, 06/04, page 672 of 980
I/O7-0
A18-0
WE
OE
CE
Note : Data is latched at the rising edge of
CC
= 3.0 V to 3.6 V, V
Figure 18.29 Memory Read Timing after Command Write
t
ces
Command write
tf
t
t
t
Symbol
t
t
t
t
t
nxtc
ceh
ces
dh
ds
wep
r
f
t
t
ds
wep
SS
= 0 V, T
t
tr
ceh
t
Min
20
0
0
50
50
70
dh
a
= 25°C ± 5°C
t
nxtc
Max
30
30
WE
.
Unit
µs
ns
ns
ns
ns
ns
ns
ns
Memory read mode
Address stable
Note