HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 818

MCU 5V 512K,PB-FREE 100-TQFP

HD64F3029XBL25V

Manufacturer Part Number
HD64F3029XBL25V
Description
MCU 5V 512K,PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheet

Specifications of HD64F3029XBL25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, PWM, WDT
Number Of I /o
70
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
8. Block transfer instructions
Notes: *1 The number of states is the number of states required for execution when the
Mnemonic
EEPMOV. B
EEPMOV. W
*2 n is the value set in register R4L or R4.
(1) Set to 1 when a carry or borrow occurs at bit 11; otherwise cleared to 0.
(2) Set to 1 when a carry or borrow occurs at bit 27; otherwise cleared to 0.
(3) Retains its previous value when the result is zero; otherwise cleared to 0.
(4) Set to 1 when the adjustment produces a carry; otherwise retains its previous value.
(5) The number of states required for execution of an instruction that transfers data in
(6) Set to 1 when the divisor is negative; otherwise cleared to 0.
(7) Set to 1 when the divisor is zero; otherwise cleared to 0.
(8) Set to 1 when the quotient is negative; otherwise cleared to 0.
instruction and its operands are located in on-chip memory. For other cases see
section A.3.
synchronization with the E clock is variable.
Instruction Length (bytes)
Addressing Mode and
4
4
Operation
if R4L - 0
else next;
if R4 - 0
else next;
repeat @R5
until
repeat @R5
until
R5+1
R6+1
R4L–1
R4L=0
R5+1
R6+1
R4–1
R4=0
@R6
@R6
R4
R5
R6
R5
R6
R4L
Rev. 2.0, 06/04, page 789 of 980
— — — — — —
— — — — — —
I
Condition Code
H N
Z
V C
4n*
4n*
States*
8+
8+
No. of
2
2
1

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