HD64F3029XBL25V Renesas Electronics America, HD64F3029XBL25V Datasheet - Page 616

• Manufacturer Part Number: HD64F3029XBL25V
• Description: MCU 5V 512K,PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of HD64F3029XBL25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

18.3
Flash memory is controlled by the pin as shown in table 18.3.
Table 18.3 Pin Configuration
Pin Name
Reset
Flash programming
enable
Mode 2
Mode 1
Mode 0
Non-maskable
interrupt
Transmit data
Receive data
Note: For the pin configuration in PROM mode, see section 18.9, PROM Mode.
Pin Configuration
Abbreviation
RES
FWE
MD2
MD1
MD0
NMI
TxD1
RxD1
Input/Output
Input
Input
Input
Input
Input
Output
Input
Input
Function
Reset
Hardware protection when programming
flash memory
Sets operating mode of this LSI
Sets operating mode of this LSI
Sets operating mode of this LSI
Sets operating mode of this LSI
Serial transmit data output (used in boot
mode)
Serial receive data input (used in boot
mode)
Rev. 2.0, 06/04, page 587 of 980