MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 121

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

4.1 Contents
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Advance Information — MMC2114, MMC2113, and MMC2112
Section 4. Chip Configuration Module (CCM)
4.2
4.3
4.4
4.4.1
4.4.2
4.4.3
4.4.4
4.5
4.6
4.7
4.7.1
4.7.2
4.7.3
4.7.3.1
4.7.3.2
4.7.3.3
4.7.3.4
4.8
4.8.1
4.8.2
4.8.3
4.8.4
4.8.5
4.8.6
4.9
4.10
Freescale Semiconductor, Inc.
For More Information On This Product,
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Modes of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .122
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124
Memory Map and Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Interrupts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Master Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Single-Chip Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
Emulation Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123
Factory Access Slave Test (FAST) Mode . . . . . . . . . . . . . 123
Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Reset Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133
Chip Mode Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Boot Device Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Output Pad Strength Configuration . . . . . . . . . . . . . . . . . .137
Clock Mode Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Internal FLASH Configuration . . . . . . . . . . . . . . . . . . . . . . 138
Chip Configuration Module (CCM)
Chip Configuration Register . . . . . . . . . . . . . . . . . . . . . . 126
Reset Configuration Register . . . . . . . . . . . . . . . . . . . . . 129
Chip Identification Register . . . . . . . . . . . . . . . . . . . . . . 131
Chip Test Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132
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Advance Information
121