MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 43
MMC2114CFCAG33
Manufacturer Part Number
MMC2114CFCAG33
Description
IC MCU 32BIT 33MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Specifications of MMC2114CFCAG33
Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2114
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
104
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Controller Family/series
MCORE
No. Of I/o's
104
Ram Memory Size
32KB
Cpu Speed
33MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
135
Company:
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Table
23-1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 613
23-2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614
23-3 ESD Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . .615
23-4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 616
23-5 PLL Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . 618
23-6 QADC Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 620
23-7 QADC Electrical Specifications (Operating) . . . . . . . . . . . . . .621
23-8 QADC Conversion Specifications (Operating) . . . . . . . . . . . . 622
23-9 SGFM FLASH Program and Erase Characteristics . . . . . . . . 624
23-10 SGFM FLASH Module Life Characteristics . . . . . . . . . . . . . . 624
23-11 External Interface Timing Characteristics . . . . . . . . . . . . . . . 625
23-12 GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 630
23-13 Reset and Configuration Override Timing . . . . . . . . . . . . . . . 631
23-14 SPI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 632
23-15 OnCE, JTAG, and Boundary Scan Timing . . . . . . . . . . . . . . . 635
25-1 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .647
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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