MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 570

no-image

MMC2114CFCAG33

Manufacturer Part Number
MMC2114CFCAG33
Description
IC MCU 32BIT 33MHZ 144-LQFP
Manufacturer
Freescale Semiconductor
Series
MCorer
Datasheets

Specifications of MMC2114CFCAG33

Core Processor
M210
Core Size
32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
MMC2114
Core
M-CORE
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
104
Number Of Timers
2
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Controller Family/series
MCORE
No. Of I/o's
104
Ram Memory Size
32KB
Cpu Speed
33MHz
No. Of Timers
2
Embedded Interface Type
SCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
135
Part Number:
MMC2114CFCAG33
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MMC2114CFCAG33
Manufacturer:
FREESCALE
Quantity:
8 000
Part Number:
MMC2114CFCAG33
Manufacturer:
XILINX
0
Company:
Part Number:
MMC2114CFCAG33
Quantity:
62
JTAG Test Access Port and OnCE
22.5.5 HIGHZ Instruction
22.5.6 CLAMP Instruction
22.5.7 BYPASS Instruction
Advance Information
570
state until TRST is asserted. While the OnCE TAP controller is enabled,
the top-level JTAG remains transparent.
The HIGHZ instruction is provided as a manufacturer’s optional public
instruction to prevent having to backdrive the output pins during
circuit-board testing. When HIGHZ is invoked, all output drivers,
including the 2-state drivers, are turned off (for example, high
impedance). The instruction selects the Bypass Register. HIGHZ also
asserts internal reset for the system logic to force a predictable internal
state.
The CLAMP instruction selects the Bypass Register and asserts internal
reset while simultaneously forcing all output pins and bidirectional pins
configured as outputs to the fixed values that are preloaded and held in
the Boundary Scan Update Register. This instruction enhances test
efficiency by reducing the overall shift path to a single bit (the Bypass
Register) while conducting an EXTEST type of instruction through the
Boundary Scan Register.
The BYPASS instruction selects the single-bit Bypass Register, creating
a single-bit shift register path from the TDI pin to the Bypass Register to
the TDO pin. This instruction enhances test efficiency by reducing the
overall shift path when a device other than the processor becomes the
device under test on a board design with multiple chips on the overall
IEEE 1149.1 standard defined boundary scan chain. The Bypass
Register has been implemented in accordance with IEEE 1149.1
standard so that the shift register state is set to logic 0 on the rising edge
of TCLK following entry into the capture-DR state. Therefore, the first bit
to be shifted out after selecting the Bypass Register is always a logic 0
(to differentiate a part that supports an IDCODE register from a part that
supports only the Bypass Register).
Freescale Semiconductor, Inc.
For More Information On This Product,
JTAG Test Access Port and OnCE
Go to: www.freescale.com
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA

Related parts for MMC2114CFCAG33