D12321VF25V Renesas Electronics America, D12321VF25V Datasheet - Page 1005

IC H8S/2300 MCU ROMLESS 128QFP

D12321VF25V

Manufacturer Part Number
D12321VF25V
Description
IC H8S/2300 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12321VF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
86
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
D12321VF25V
Manufacturer:
Renesas
Quantity:
675
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Item
CAS setup time
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
(4) DMAC Timing
Table 22.18 DMAC Timing
Condition B: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
0 V, φ = 2 MHz to 25 MHz, T
T
a
CC
= –40°C to 85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
Symbol
t
t
t
t
t
t
t
WTS
WTH
CSR
BRQS
BACD
BZD
BRQOD
CC
Min
0.5 × t
25
5
30
Min
25
10
= 3.0 V to 3.6 V, V
a
Condition B
= –20°C to 75°C (regular specifications),
cyc
– 8
Condition B
Max
18
18
18
Rev.6.00 Sep. 27, 2007 Page 973 of 1268
Max
15
40
25
Section 22 Electrical Characteristics
ref
Unit
ns
ns
= 2.7 V to AV
Unit
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figure 22.19
Figure 22.18
Figures 22.16 and 22.17
Test Conditions
Figure 22.10
Figure 22.8
Figure 22.14
Figure 22.15
CC
REJ09B0220-0600
, V
SS
= AV
SS
=

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