D12321VF25V Renesas Electronics America, D12321VF25V Datasheet - Page 1299

IC H8S/2300 MCU ROMLESS 128QFP

D12321VF25V

Manufacturer Part Number
D12321VF25V
Description
IC H8S/2300 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12321VF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
86
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
D12321VF25V
Manufacturer:
Renesas
Quantity:
675
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
P-TQFP120-14x14-0.40
JEITA Package Code
120
91
e
90
1
Z
D
RENESAS Code
PTQP0120LA-A
Appendix F Package Dimensions
Index mark
*1
H
D
Figure F.1 TFP-120 Package Dimensions
D
y
TFP-120/TFP-120V
*3
Previous Code
b
p
61
30
x
60
31
M
F
MASS[Typ.]
0.5g
Rev.6.00 Sep. 27, 2007 Page 1267 of 1268
Terminal cross section
Appendix F Package Dimensions
Detail F
b
b
1
p
L
1
L
θ
REJ09B0220-0600
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
L
D
E
A
H
H
A
A
b
b
c
c
θ
x
y
Z
Z
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
15.8
15.8 16.0 16.2
0.00
0.12
0.12
Min
0.4
Nom
1.00
16.0
0.10
0.17
0.15
0.17
0.15
1.20
1.20
0.4
0.5
1.0
14
14
16.2
1.20
0.20
0.22
0.22
0.07
0.10
Max
0.6

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