D12321VF25V Renesas Electronics America, D12321VF25V Datasheet - Page 226

IC H8S/2300 MCU ROMLESS 128QFP

D12321VF25V

Manufacturer Part Number
D12321VF25V
Description
IC H8S/2300 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12321VF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
86
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
D12321VF25V
Manufacturer:
Renesas
Quantity:
675
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 6 Bus Controller
Rev.6.00 Sep. 27, 2007 Page 194 of 1268
REJ09B0220-0600
To select RAS up mode, clear the RCDM bit in MCR to 0. Each time access to DRAM space
is interrupted and another space is accessed, the RAS signal goes high again. Burst operation is
only performed if DRAM space is continuous. Figure 6.22 shows an example of the timing in
RAS up mode.
In the case of burst ROM space access, the RAS signal is not restored to the high level.
RAS up mode
CAS, LCAS
Note: n = 2 to 5
CSn (RAS)
D
A
15
23
to D
to A
φ
0
0
Figure 6.22 Example of Operation Timing in RAS Up Mode
T
p
DRAM access
T
r
T
c1
T
c2
DRAM access
T
c1
T
c2
External space
T
1
access
T
2

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