D12321VF25V Renesas Electronics America, D12321VF25V Datasheet - Page 199

• Manufacturer Part Number: D12321VF25V
• Description: IC H8S/2300 MCU ROMLESS 128QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12321VF25V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 86
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• For Use With: EDK2329 - DEV EVALUATION KIT H8S/2329
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Table 6.3
ABWCR
ABWn
0
1
6.3.3
The chip’s memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; a DRAM interface * that allows direct connection of DRAM; and a burst
ROM interface that allows direct connection of burst ROM. The interface can be selected
independently for each area.
An area for which the basic bus interface is designated functions as normal space, an area for
which the DRAM interface * is designated functions as DRAM space, and an area for which the
burst ROM interface is designated functions as burst ROM space.
Note: * The DRAM interface is not supported in the H8S/2321.
Memory Interfaces
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
WCRH, WCRL
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Rev.6.00 Sep. 27, 2007 Page 167 of 1268
Access States
2
3
2
3
Section 6 Bus Controller
REJ09B0220-0600
Program Wait
States
0
0
1
2
3
0
0
1
2
3