D12321VF25V Renesas Electronics America, D12321VF25V Datasheet - Page 231

IC H8S/2300 MCU ROMLESS 128QFP

D12321VF25V

Manufacturer Part Number
D12321VF25V
Description
IC H8S/2300 MCU ROMLESS 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12321VF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
86
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
D12321VF25V
Manufacturer:
Renesas
Quantity:
675
Part Number:
D12321VF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.6.2
When DRAM space is accessed in DMAC single address mode, full access (normal access) is
always performed. The DACK output goes low from the T
interface.
In modes other than DMAC single address mode, burst access can be used when accessing DRAM
space.
Figure 6.29 shows the DACK output timing for the DRAM interface when DDS = 0.
Figure 6.29 DACK Output Timing when DDS = 0 (Example of DRAM Access)
When DDS = 0
Read
Write
Note: n = 2 to 5
LCAS (LCAS)
CAS (UCAS)
CSn (RAS)
HWR (WE)
HWR (WE)
D
D
A
15
15
23
DACK
to D
to D
to A
φ
0
0
0
T
p
Row
T
r
Rev.6.00 Sep. 27, 2007 Page 199 of 1268
r
state in the case of the DRAM
T
c1
Column
T
Section 6 Bus Controller
c2
REJ09B0220-0600

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