PIC18F97J60-I/PF Microchip Technology, PIC18F97J60-I/PF Datasheet - Page 450

• Manufacturer Part Number: PIC18F97J60-I/PF
• Description: IC PIC MCU FLASH 65KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F97J60-I/PF

• Program Memory Type: FLASH
• Program Memory Size: 128KB (64K x 16)
• Package / Case: 100-TQFP, 100-VQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 41.667MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 70
• Ram Size: 3808 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3808 B
• Interface Type: Display Driver/Ethernet/EUSART/I2C/MSSP/SPI
• Maximum Clock Frequency: 41.667 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 5
• Operating Supply Voltage: 2.35 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• Package: 100TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 41.667 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162064 - HEADER INTFC MPLABICD2 64/80/100DM163024 - BOARD DEMO PICDEM.NET 2
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F97J60 FAMILY
29.2
The following sections give the technical details of the packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39762B-page 450
Note:
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
A
L
F
E
D
c
B
L
n
MIN
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
2
1
Preliminary
0
5
5
D1
.039 REF.
INCHES
CH x 45°
NOM
D
.024
.394
.394
.020
.043
.039
.006
.472
.472
.007
.009
.035
3.5
64
16
10
10
A1
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
F
15
15
7
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
0.18
0.22
0.89
Revised 07-22-05
3.5
64
16
10
10
MAX
A2
12.25
12.25
10.10
10.10
1.14
1.20
1.05
0.25
0.75
0.23
0.27
15
15
7