PIC18F97J60-I/PF Microchip Technology, PIC18F97J60-I/PF Datasheet - Page 451
![IC PIC MCU FLASH 65KX16 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC18F97J60-I/PF
Manufacturer Part Number
PIC18F97J60-I/PF
Description
IC PIC MCU FLASH 65KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F66J65-IPT.pdf
(8 pages)
3.PIC18F66J65-IPT.pdf
(480 pages)
4.PIC18F66J65-IPT.pdf
(4 pages)
5.PIC18F66J65-IPT.pdf
(10 pages)
6.PIC18F96J60-IPT.pdf
(24 pages)
7.PIC18F97J60-IPF.pdf
(472 pages)
Specifications of PIC18F97J60-I/PF
Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
100-TQFP, 100-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
41.667MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
70
Ram Size
3808 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3808 B
Interface Type
Display Driver/Ethernet/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
41.667 MHz
Number Of Programmable I/os
70
Number Of Timers
5
Operating Supply Voltage
2.35 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183033
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
Package
100TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
41.667 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162064 - HEADER INTFC MPLABICD2 64/80/100DM163024 - BOARD DEMO PICDEM.NET 2
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F97J60-I/PF
Manufacturer:
MICRRCHIP
Quantity:
1 800
Company:
Part Number:
PIC18F97J60-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F97J60-I/PF
Manufacturer:
MICROCHI
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC18F66J65-IPT PDF datasheet #2
- PIC18F66J65-IPT PDF datasheet #3
- PIC18F66J65-IPT PDF datasheet #4
- PIC18F66J65-IPT PDF datasheet #5
- PIC18F96J60-IPT PDF datasheet #6
- PIC18F97J60-IPF PDF datasheet #7
- Current page: 451 of 472
- Download datasheet (8Mb)
8
© 2006 Microchip Technology Inc.
0-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-092
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
B
See ASME Y14.5M
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
L
F
E
D
B
A
c
n
MIN
.039
.037
.002
.018
.004
.007
.025
Preliminary
2
1
D1
0°
5°
5°
CH x 45°
.039 REF.
L
.020 BSC
.551 BSC
.551 BSC
.472 BSC
.472 BSC
INCHES
D
NOM
.043
.004
.024
.006
.035
A1
.039
.009
3.5°
PIC18F97J60 FAMILY
10°
10°
80
20
A
MAX
.047
.006
.030
.008
.045
.041
.011
15°
15°
F
7°
MIN
1.00
0.95
0.05
0.45
0.09
0.17
0.64
0°
5°
5°
MILLIMETERS*
14.00 BSC
14.00 BSC
12.00 BSC
12.00 BSC
1.00 REF.
0.50 BSC
NOM
1.10
1.00
0.10
0.60
0.15
0.22
0.89
3.5°
Revised 07-22-05
10°
10°
80
20
A2
DS39762B-page 451
MAX
1.14
1.20
1.05
0.15
0.75
0.20
0.27
15°
15°
7°
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