EP3SE50F780I3N Altera, EP3SE50F780I3N Datasheet - Page 354

• Manufacturer Part Number: EP3SE50F780I3N
• Description: Stratix III
• Manufacturer: Altera

Stratix III Hot-Socketing Specifications
10–2
Stratix III Device Handbook, Volume 1
f
Devices Can Be Driven Before Power-Up
You can drive signals into I/O pins, dedicated input pins, and dedicated
clock pins of Stratix III devices before or during power-up or
power-down without damaging the device. Stratix III devices support
power-up or power-down of the V
supplies in any sequence in order to simplify system level design.
I/O Pins Remain Tri-Stated During Power-Up
A device that does not support hot-socketing may interrupt system
operation or cause contention by driving out before or during power-up.
In a hot socketing situation, the Stratix III device's output buffers are
turned off during system power-up or power-down. Also, the Stratix III
device does not drive out until the device is configured and working
within recommended operating conditions.
Insertion or Removal of a Stratix III Device from a Powered-Up
System
Devices that do not support hot-socketing can short power supplies when
powered-up through the device signal pins. This irregular power-up can
damage both the driving and driven devices and can disrupt card
power-up.
A Stratix III device may be inserted into (or removed from) a powered-up
system board without damaging or interfering with system-board
operation.
You can power-up or power-down the V
supplies in any sequence. The individual power supply ramp-up and
ramp-down rates can range from 50 μs to 100 ms. During hot socketing,
the I/O pin capacitance is less than 15 pF and the clock pin capacitance is
less than 20 pF.
For more information on the hot socketing specification, refer to the
and Switching Characteristics of Stratix III Devices
the Stratix III Handbook and the
Feature and Testing for Altera Devices White
A possible concern regarding hot-socketing is the potential for latch-up.
Latch-up can occur when electrical subsystems are hot-socketed into an
active system. During hot-socketing, the signal pins may be connected
and driven by the active system before the power supply can provide
current to the device's power and ground planes. This condition can lead
to latch-up and cause a low-impedance path from power to ground
Hot-Socketing and Power-Sequencing
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