R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 1193

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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R4F24278NVFQU
Manufacturer:
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H8S/2427, H8S/2427R, H8S/2425 Group
23.11
Setting the mode pins to mode 3 and resetting the hardware shifts the flash memory into boot
mode. In this mode, the embedded standard program is executed.
Boot mode executes programming/erasing of the user ROM, data flash, or user boot ROM by
means of the control command and program data transmitted from the externally connected host
via the on-chip SCI_1.
In boot mode, the tool for transmitting the control command and program data, and the program
data must be prepared in the host. The serial communication mode is set to asynchronous mode.
The system configuration in boot mode is shown in figure 23.9. Interrupts are ignored in boot
mode. Configure the user system so that interrupts do not occur.
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
tool and program
Boot Mode
Programming
Host
data
Figure 23.9 System Configuration in Boot Mode
Control command,
program data
Response
RxD1
TxD1
Software for
analyzing
control
commands
(on-chip)
SCI_1
This LSI
On-chip
memory
MD2 to MD0
Flash
RAM
Section 23 Flash Memory
Page 1163 of 1448
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