R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 30

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

28.3 Timing Charts (3-V Version)........................................................................................... 1331
28.4 Electrical Characteristics for H8S/2427 Group (5-V Version) ........................................ 1363
28.5 Electrical Characteristics for H8S/2425 Group (5-V Version) ........................................ 1379
28.6 Timing Charts (5-V Version)........................................................................................... 1393
Appendix
A.
B.
C.
Index
Page xxx of xxx
28.2.5 D/A Conversion Characteristics ......................................................................... 1329
28.2.6 Flash Memory Characteristics ............................................................................ 1330
28.3.1 Clock Timing ...................................................................................................... 1331
28.3.2 Control Signal Timing ........................................................................................ 1333
28.3.3 Bus Timing ......................................................................................................... 1334
28.3.4 DMAC and EXDMAC Timing........................................................................... 1354
28.3.5 Timing of On-Chip Peripheral Modules ............................................................. 1357
28.4.1 Absolute Maximum Ratings ............................................................................... 1363
28.4.2 DC Characteristics .............................................................................................. 1364
28.4.3 AC Characteristics .............................................................................................. 1368
28.4.4 A/D Conversion Characteristics ......................................................................... 1377
28.4.5 D/A Conversion Characteristics ......................................................................... 1377
28.4.6 Flash Memory Characteristics ............................................................................ 1378
28.5.1 Absolute Maximum Ratings ............................................................................... 1379
28.5.2 DC Characteristics .............................................................................................. 1380
28.5.3 AC Characteristics .............................................................................................. 1384
28.5.4 A/D Conversion Characteristics ......................................................................... 1391
28.5.5 D/A Conversion Characteristics ......................................................................... 1391
28.5.6 Flash Memory Characteristics ............................................................................ 1392
28.6.1 Clock Timing ...................................................................................................... 1393
28.6.2 Control Signal Timing ........................................................................................ 1395
28.6.3 Bus Timing ......................................................................................................... 1396
28.6.4 DMAC and EXDMAC Timing........................................................................... 1406
28.6.5 Timing of On-Chip Peripheral Modules ............................................................. 1409
Port States in Each Processing State ................................................................................ 1415
Package Dimensions ........................................................................................................ 1436
Treatment of Unused Pins................................................................................................ 1440
.......................................................................................................1415
.......................................................................................................1443