R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 1371

no-image

R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24278NVFQU
Manufacturer:
REALTEK
Quantity:
2 300
Part Number:
R4F24278NVFQU
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2427, H8S/2427R, H8S/2425 Group
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
DACK0, DACK1
Read
Write
Note: DACK and EDACK timing: when DDS = 0 and EDDS = 0
EDACK2, EDACK3
RAS timing: when RAST = 0
Figure 28.15 DRAM Access Timing: Two-State Access
φ
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
, DACK3
t
AD
Tp
t
t
AS3
PCH2
Tr
t
CSD2
t
t
DACD1
EDACD1
t
AH1
t
t
AD
t
WRD2
WDD
t
Tc1
OED1
t
t
AS2
AC4
t
/t
WDS1
t
OED1B
WCS1
t
AA3
Section 28 Electrical Characteristics
t
t
WCH1
CASD1
t
AC1
Tc2
t
WDH2
t
CASW1
t
AH2
t
RDS2
t
WRD2
t
t
OED1
RDH2
t
t
DACD2
EDACD2
Page 1341 of 1448
t
/t
CASD1
t
OED1B
CSD3

Related parts for R4F24278NVFQU