R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 297

• Manufacturer Part Number: R4F24278NVFQU
• Description: MCU 512K/48K 2.7-5.5V 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2400r

Specifications of R4F24278NVFQU

• Core Processor: H8S/2600
• Core Size: 16/32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 98
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

H8S/2427, H8S/2427R, H8S/2425 Group
7.8.11
When synchronous DRAM with a ×16-bit configuration is connected, DQMU and DQML are
used for the control signals needed for byte access.
Figures 7.61 and 7.62 show the control timing for DQM, and figure 7.63 shows an example of
connection of byte control by DQMU and DQML.
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
Upper data bus
Lower data bus
Precharge-sel
Address bus
Byte Access Control
SDRAMφ
DQMU
DQML
CKE
RAS
CAS
WE
(Upper Byte Write Access: SDWCD = 0, CAS Latency 2)
Figure 7.61 DQMU and DQML Control Timing
Column address
PALL
T
p
Row address
Row address
ACTV
T
r
NOP
High
High
T
c1
High impedance
Column address
WRIT
T
cl
Section 7 Bus Controller (BSC)
NOP
T
c2
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