R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 457

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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H8S/2427, H8S/2427R, H8S/2425 Group
(5)
DREQ pin falling edge detection is performed in synchronization with DMAC internal operations.
The operation is as follows:
[1] Activation request wait state: Waits for detection of a low level on the DREQ pin, and
[2] Transfer wait state: Waits for DMAC data transfer to become possible, and switches to [3].
[3] Activation request disabled state: Waits for detection of a high level on the DREQ pin, and
After DMAC transfer is enabled, a transition is made to [1]. Thus, initial activation after transfer is
enabled is performed on detection of a low level.
REJ09B0565-0100 Rev. 1.00
Jul 22, 2010
switches to [2].
switches to [1].
Activation by Falling Edge on DREQ Pin
Internal write signal
Internal read signal
External address
Figure 8.45 Example in which Low Level Is Not Output at TEND Pin
Internal address
HWR, LWR
TEND
φ
External write by CPU, etc.
Not output
DMA
read
Section 8 DMA Controller (DMAC)
DMA
write
Page 427 of 1448

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