R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 443

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Manufacturer
Quantity
Price
Part Number:
R4F24278NVFQU
Manufacturer:
REALTEK
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Part Number:
R4F24278NVFQU
Manufacturer:
Renesas Electronics America
Quantity:
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H8S/2427, H8S/2427R, H8S/2425 Group
Section 8 DMA Controller (DMAC)
DREQ pin sampling is performed every cycle, with the rising edge of the next φ cycle after the
end of the DMABCR write cycle in common register enabled mode or DMAECRS write cycle in
common register disabled mode for setting the transfer enabled state as the starting point.
When the DREQ pin low level is sampled while acceptance by means of the DREQ pin is
possible, the request is held in the DMAC. Then, when activation is initiated in the DMAC, the
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
8.5.11
Write Data Buffer Function
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCR in the bus controller is set to 1, enabling the write data buffer
function, dual address transfer external write cycles or single address transfer and internal accesses
(on-chip memory or internal I/O registers) are executed in parallel. Internal accesses are
independent of the bus mastership, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be
output from the TEND pin is an external bus cycle. However, a low level is not output from the
TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an internal
bus cycle, and an external write cycle is executed in parallel with this cycle.
REJ09B0565-0100 Rev. 1.00
Page 413 of 1448
Jul 22, 2010

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