R4F24278NVFQU Renesas Electronics America, R4F24278NVFQU Datasheet - Page 315

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R4F24278NVFQU

Manufacturer Part Number
R4F24278NVFQU
Description
MCU 512K/48K 2.7-5.5V 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24278NVFQU

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, Smart Card, SPI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
98
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24278NVFQU
Manufacturer:
REALTEK
Quantity:
2 300
Part Number:
R4F24278NVFQU
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2427, H8S/2427R, H8S/2425 Group
Section 7 Bus Controller (BSC)
When DDS = 0 or EDDS = 0: When continuous synchronous DRAM space is accessed in
DMAC or EXDMAC single address transfer mode, full access (normal access) is always
performed. With the synchronous DRAM interface, the DACK or EDACK output goes low from
the T
state.
r
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing continuous synchronous DRAM space.
Figure 7.73 shows the DACK or EDACK output timing for connecting the synchronous DRAM
interface when DDS = 0 or EDDS = 0.
REJ09B0565-0100 Rev. 1.00
Page 285 of 1448
Jul 22, 2010

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