DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 138

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

Bits A31 to A24 do not affect the operation.
Bits A23 to A21 are decoded by the chip select signals (CS3 to CS0) for each area and output.
Bit A20 is not output externally.
Bits A19 to A0 are output externally.
Enabling or disabling external output of bits A19 to A0 can be selected by the setting of PFCR1.
For details, refer to section 8.11.1, Port Function Control Register 1 (PFCR1).
Table 6.2 and figure 6.7 show the address map.
Table 6.2
Note:
Rev. 2.00, 03/04, page 104 of 534
Address
H'000000 to
H'1FFFFF
H'200000 to
H'3FFFFF
H'400000 to
H'DFFFFF
H'E00000 to
H'FFFFFF
*
On-chip RAM space when the RAME bit in SYSCR is 1.
Address Map
Space Type
CS0 space/
on-chip ROM space
CS1 space
CS2 space/
DRAM space
CS3 space/
on-chip RAM space*/
I/O space
Memory Type
External space/
on-chip ROM
External space
External space/
DRAM
External space/
on-chip RAM*/I/O space
Size
2 Mbytes
2 Mbytes
10 Mbytes
2 Mbytes
Bus
Width
8/16
8/16
8/16
8/16