DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 384

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00, 03/04, page 350 of 534
Yes
Clear EP1 FIFO full status
Set EP1 FIFO full status
(EP1 FULL in IFR0 = 1)
(EP1 FULL in IFR0 = 0)
Receive data from host
ACK
any space in both EP1
Receive PING token
Receive OUT token
Is there any space
any space in other
Is receive data
in EP1 FIFO?
EP1 FIFO?
Yes
length 0?
Yes
Yes
Is there
Is there
FIFOs?
No
ACK (for only PING)
Figure 12.10 EP1 Bulk-Out Transfer Operation
USB function
NYET (High speed)
ACK (Full speed)
No
No
No
Full speed
High speed
NAK
Set EP1 FIFO full status
(EP1 FULL in IFR0 = 1)
Interrupt generated
Interrupt generated
Confirm receive data length from
EP1 receive data size register
data register (EPDR1)
Read data from EP1
Firmware
(EPSZ1)

Related parts for DF2170BVTE33V