DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 386

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Rev. 2.00, 03/04, page 352 of 534
(EP2 EMPTY in IFR0 = 0)
Clear EP2 empty status
Transmit data to host
Is there any space
Receive IN token
in EP2 FIFO?
in EP2 FIFO?
Valid data
Yes
No
ACK
USB function
Figure 12.11 EP2 Bulk-In Transfer Operation
Yes
No
NAK
(EP2 EMPTY in IFR0 = 1)
Set EP2 empty status
Interrupt generated
to packet enable register 2 (EPDR2)
Write number of transmit data bytes
Disable EP2 FIFO empty interrupt
Enable EP2 FIFO empty interrupt
Write one-packet data to EP2
(EP2 EMPTY in IER0 = 1)
(EP2 EMPTY in IER0 = 0)
any data to be transmitted
data register (EPDR2)
been transmitted
Has all data
Firmware
to host?
to host?
Is there
Yes
No
Yes
No

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