DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 440

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

On-chip RAM Address Map when Programming/Erasing is Executed: Parts of the procedure
program that are made by the user, like download request, programming/erasing procedure, and
determination of the result, must be executed in the on-chip RAM. The on-chip program that is to
be downloaded is all in the on-chip RAM. Note that area in the on-chip RAM must be controlled
so that these parts do not overlap.
Figure 14.10 shows the program area to be downloaded.
Rev. 2.00, 03/04, page 406 of 534
programming/erasing
processing period
Unusable area in
(Size : 2 kbytes)
downloaded
Area to be
Figure 14.10 RAM Map When Programming/Erasing is Executed
Initialization + programming program
Programming/erasing program entry
Initialization + erasing program
Area that can be used by user
Area that can be used by user
Initialization program entry
(Return value: 1 byte)
<
System use area
On-chip RAM
(15 bytes)
DPFR
or
>
RAMTOP
FTDAR setting
FTDAR setting + 16
FTDAR setting + 32
FTDAR setting + 2 kbytes
RAMEND
Address