DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 438

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

Rev. 2.00, 03/04, page 404 of 534
(Program end notice)
2.
4.
(reset by boot mode)
Wait for program data
programming/erasing
Boot mode initiation
setting command
Figure 14.8 Overview of Boot Mode State Transition Diagram
Wait for inquiry
3.
command
Wait for
user boot MAT erasure
(Program command reception)
(Erasure end selection
command reception)
All user MAT and
(Program data transmission)
Inquiry command response
H'00.......H'00 reception
(adjustment completed)
Inquiry command reception
Read/check command
reception
(Bit rate adjustment)
H'00 transmission
Command response
(Erasure selection command reception)
read/check command
Bit rate adjustment
Wait for erase-block
Processing of
inquiry setting
Processing of
command
data
(Erase-block specification)
1.