DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 139

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

6.4.3
The external address space bus specifications consist of five elements: bus width, number of
access states, number of program wait states, read strobe timing, and chip select (CS) assertion
period extension states. The bus width and number of access states for on-chip memory and
internal I/O registers are fixed, and are not affected by the bus controller.
Bus Width: A bus width of 8 or 16 bits can be selected with ACSCR. An area for which an 8-bit
bus is selected functions as an 8-bit access space, and an area for which a 16-bit bus is selected
functions as a 16-bit access space.
Bus Specifications
H'000000
H'040000
H'200000
H'400000
H'E00000
H'FF7000
H'FFF000
H'FFFC00
H'FFFFFF
Figure 6.7 Address Map
On-chip ROM
On-chip RAM
I/O
Area 0
Area 1
Area 2
Area 3
Rev. 2.00, 03/04, page 105 of 534