DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 456

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

Table 14.9 (2)
Rev. 2.00, 03/04, page 422 of 534
Item
Operation for Selection
of On-chip Program to
be Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Inhibit of
Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Erasure Parameter
Execution of Erasure
Determination of
Erasure Result
Useable Area for Erasure in User Program Mode
On-chip
RAM
Storable /Executable Area
User
MAT
×
×
×
×
×
×
External Space
(Expanded Mode) User MAT
×
×
×
Selected MAT
Embedded
Program
Storage Area