DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 20

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

14.7 Flash Memory Emulation in RAM ................................................................................... 432
14.8 Programmer Mode ............................................................................................................ 434
14.9 Serial Communication Interface Specification for Boot Mode......................................... 435
14.10 Usage Notes ...................................................................................................................... 461
Section 15 Clock Pulse Generator..................................................................... 463
15.1 Oscillator........................................................................................................................... 463
15.2 PLL Circuit ....................................................................................................................... 466
15.3 Usage Notes ...................................................................................................................... 467
Section 16 Power-Down Modes........................................................................ 469
16.1 Register Descriptions........................................................................................................ 472
16.2 Operation .......................................................................................................................... 474
16.3 Usage Notes ...................................................................................................................... 478
Section 17 List of Registers............................................................................... 479
17.1 Register Addresses (Address Order)................................................................................. 480
17.2 Register Bits...................................................................................................................... 485
17.3 Register States in Each Operating Mode .......................................................................... 493
Section 18 Electrical Characteristics ................................................................. 497
18.1 Absolute Maximum Ratings ............................................................................................. 497
18.2 DC Characteristics ............................................................................................................ 498
18.3 AC Characteristics ............................................................................................................ 501
Rev. 2.00, 03/04, page xviii of xxxii
14.7.1 Emulation in RAM .............................................................................................. 432
14.7.2 RAM Overlap ...................................................................................................... 433
15.1.1 Connecting Crystal Resonator ............................................................................. 463
15.1.2 External Clock Input............................................................................................ 464
15.3.1 Notes on Resonator.............................................................................................. 467
15.3.2 Notes on Board Design ........................................................................................ 467
15.3.3 Note on confirming the operation ........................................................................ 467
16.1.1 Standby Control Register (SBYCR) .................................................................... 472
16.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL) ................... 473
16.2.1 Sleep Mode .......................................................................................................... 474
16.2.2 Software Standby Mode....................................................................................... 474
16.2.3 Hardware Standby Mode ..................................................................................... 476
16.2.4 Module Stop Mode .............................................................................................. 477
16.3.1 I/O Port Status...................................................................................................... 478
16.3.2 Current Consumption during Oscillation Stabilization Standby Period .............. 478
16.3.3 On-Chip Peripheral Module Interrupts ................................................................ 478
16.3.4 Writing to MSTPCR ............................................................................................ 478
18.3.1 Clock Timing ....................................................................................................... 501
18.3.2 Control Signal Timing ......................................................................................... 503