DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 560

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
C.
Rev. 2.00, 03/04, page 526 of 534
*Dimension including the plating thickness
Base material dimension
Package Dimensions
*
0.22 ± 0.05
0.20 ± 0.04
100
76
75
1
Figure C.1 Package Dimensions (TFP-100B)
16.0 ± 0.2
14
0.08
0.10
1.0
M
51
25
50
26
Package Code
JEDEC
JEITA
Mass (reference value)
0.5 ± 0.1
1.0
TFP-100B
Conforms
0.5 g
0˚ – 8˚

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