DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 175

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

When DDS = 0: When DRAM space is accessed in DMAC single address transfer mode, full
access (normal access) is always performed. With the DRAM interface, the DACK output goes
low from the T
In modes other than DMAC single address transfer mode, burst access can be used when accessing
DRAM space.
Figure 6.43 shows the DACK output timing for the DRAM interface when DDS = 0.
Figure 6.42 Example of DACK Output Timing when DDS = 1 (RAST = 0, CAST = 0)
Read
Write
r
state.
φ
Address bus
Data bus
Data bus
(
(
(
(
(
,
)
)
)
)
)
T
p
Row address
High
High
T
r
T
c1
Rev. 2.00, 03/04, page 141 of 534
Column address
T
c2