DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 241

• Manufacturer Part Number: DF2170BVTE33V
• Description: IC H8S/2170 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2170BVTE33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: SCI, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 76
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -

External Request/Cycle Steal Mode/Block Transfer Mode: In block transfer mode, transfer of
one block is performed continuously in the same way as in burst mode. The timing of the start of
the next block transfer is the same as in normal transfer mode. If a transfer request is generated for
another channel, an DMA cycle for the other channel is generated before the next block transfer.
The DREQ pin sensing timing is different for low level sensing and falling edge sensing. The
same applies to transfer request acceptance and transfer start timing.
Figures 7.42 to 7.45 show operation timing examples for various conditions.
• No contention/dual address mode/low level sensing (see figure 7.42)
• No contention/single address mode/falling edge sensing (see figure 7.43)
• CPU cycles/single address mode/low level sensing (see figure 7.44)
• Contention with another channel/dual address mode/low level sensing (see figure 7.45)
Rev. 2.00, 03/04, page 207 of 534