DF2170BVTE33V Renesas Electronics America, DF2170BVTE33V Datasheet - Page 35

IC H8S/2170 MCU FLASH 100-TQFP

DF2170BVTE33V

Manufacturer Part Number
DF2170BVTE33V
Description
IC H8S/2170 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2170BVTE33V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
SCI, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
76
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2170BVTE33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
1.1
• High-speed H8S/2000 CPU with an internal 16-bit architecture
• Various peripheral functions
• On-chip memory
• General I/O ports
• Supports various power-down states
• Compact package
ROM Type
Flash memory version
Package
TQFP-100
 Upward-compatible with H8/300 and H8/300H CPUs on an object level
 Sixteen 16-bit general registers
 65 basic instructions
 DMA controller (DMAC)
 8-bit timer (TMR)
 Watchdog timer (WDT)
 Serial communication interface (SCI)
 Universal serial bus 2 (USB2)
 Clock pulse generator
I/O pins: 76
Features
(Code)
TFP-100B
Model
HD64F2170
Section 1 Overview
Body Size
14.0
×
14.0 mm
256 kbytes
ROM
0.5 mm
Pin Pitch
RAM
32 kbytes
Rev. 2.00, 03/04, page 1 of 534
Remarks
Remarks

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